Precision Glass Micromachining: Where Innovation Meets Transparency
In an age where miniaturization defines progress, glass has emerged as a material of choice for engineers, scientists, and designers seeking precision, durability, and chemical stability. Yet, machining glass with micron-scale accuracy has long been one of the industry’s toughest challenges. Traditional methods such as mechanical drilling, etching, or grinding often leave chips, cracks, or surface stress that compromise both function and yield.
That’s where our advanced laser microfabrication and micromachining services come in. Partnering with two of the world’s most capable technology providers, our team offers contract manufacturing, rapid prototyping, and production solutions that deliver clean, accurate, and repeatable features in virtually any type of glass.
The Power of Ultrafast Laser Micromachining
Our principals use cutting-edge femtosecond laser systems — ultrafast, non-thermal tools that modify materials at the molecular level.
- Glass laser cutting & dicing: Smooth, chip-free edges on glass thicknesses from 30 µm to 3 mm.
- Micro-drilling: Circular or square holes down to 20 µm; aspect ratios up to 1:100; positional accuracy ±3 µm.
- Complex geometries: Blind vias, through holes, multi-depth channels with zero taper and ultra-smooth sidewalls (Ra < 1 µm).
- Metalized glasses: Process coated layers such as Au, Pt, Ni, Cr, and Mo.
These processes are ideal for semiconductor wafers, microfluidic devices, optical components, MEMS interposers, and analytical chips.
Microfluidic and Wafer-Level Manufacturing
Full design-to-production services for custom glass microfluidic chips in a cleanroom environment.
Custom carrier wafers and glass spacers (interposers) with dense precision hole arrays.
Contract Fabrication and Rapid Prototyping
Turnkey chain from prototype to production with bonding, polishing, and cleaning.
Materials: Quartz, Fused Silica, Borofloat, Soda-Lime, Alkali-free Boroaluminosilicate, Aluminosilicate. Sizes up to 300 mm × 300 mm; thicknesses 30 µm to 10 mm.
Precision Without Compromise
Applications in micro-optics, biomedical devices, sensors, and semiconductor packaging.
Ready to Get Started?
Contact us via the contact page to discuss your design, upload a drawing, or request a prototype.
